Ceramic bonded structure and method of manufacturing the same
US4542073A · kind A · utility
13Cited by
5References
31Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Apr 12, 1984 |
| Grant date | Sep 17, 1985 |
| Priority date | — |
| Expiry date | Apr 12, 2004 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC04B2237/72
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A ceramic bonded structure with a high bonding strength has a first member of a ceramic, a ceramic-modified bonding layer formed on at least a bonding surface of the first member by a thermal treatment, a metal layer formed on the ceramic-modified bonding layer, and a second member of a ceramic or metal bonded with the first member through the metal layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.