Patent · US Expired

Surface metallized semiconductors

US4542074A · kind A · utility

6Cited by

3References

3Claims

0Family size

Assignee

BAYER HEALTHCARE LLC · DE

Inventors

Kirkor Sirinyan · Bensberg, DE
Rudolf Merten · Leverkusen, DE
Gerhard D. Wolf · Dormagen, DE
Henning Giesecke · Cologne, DE
Uwe Claussen · Leverkusen, DE
Harold Ebneth · Leverkusen, DE

Key dates

Filing date	Jun 11, 1984
Grant date	Sep 17, 1985
Priority date	—
Expiry date	Jun 11, 2004

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T428/31678
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

The firmly adhesive metallization, in particular partial metallization, of the surface of semiconductors is possible, without pickling, by carrying out the activation with organometallic compounds of metals of the I and VIII Secondary Groups of the Periodic Table of Elements, then reducing in a conventional manner and metallization without current.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.