Encapsulated assemblies
US4542260A · kind A · utility
20Cited by
2References
6Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Aug 31, 1984 |
| Grant date | Sep 17, 1985 |
| Priority date | — |
| Expiry date | Aug 31, 2004 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1322
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
An encapsulated assembly of electric components (12) on a board (11) wherein the board and components are encapsulated in a mass of silicone rubber (17) which rubber mass is in turn encapsulated in a mass of rigid epoxy resin compound (21) which is partially supported by pillars (13) which are mounted on the board and extend outwardly to the surface of the mass of foamed silicone rubber, electrical connection to the components being provided by connector pins (15) extending through both encapsulations.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.