Heat sinks with staked solderable studs
US4544942A · kind A · utility
29Cited by
3References
2Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Nov 14, 1984 |
| Grant date | Oct 1, 1985 |
| Priority date | — |
| Expiry date | Nov 14, 2004 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Heat sinks of the type which are fitted onto electronic solid-state devices to maintain acceptable thermal equilibrium conditions are provided with solderable sheet-metal appendages or studs staked onto their relatively cooler portions by way of punching which deforms and flows the heat-sink material into and through shaped openings so as to create sound mechanical interlocking. The studs are oriented for projection through a printed-circuit board, along with leads from the associated electronic device, for wave-soldering into rigidly-secured relation to the board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.