Selective plating
US4545864A · kind A · utility
3Cited by
4References
13Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Oct 3, 1983 |
| Grant date | Oct 8, 1985 |
| Priority date | — |
| Expiry date | Oct 3, 2003 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01H2011/046
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A method of selective plating a component, which method comprises contacting a lower face of the component with a contoured lower mask having a plating aperture so as to expose an area of the component to be plated, positioning the component over a plating tank and selective plating the component with a plating medium, wherein the cross-sectional area of the plating aperture is enlarged at the surface of the component so as to define one or more cavities in which the plating rate is lower than elsewhere in the plating aperture.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.