High frequency electroplating device
US4545884A · kind A · utility
Inventor
Key dates
| Filing date | May 21, 1984 |
| Grant date | Oct 8, 1985 |
| Priority date | — |
| Expiry date | May 21, 2004 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D5/022
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Method and apparatus for continuous electroplating of selected portions of the inside of elongate generally tubular metallic articles including a moving conveyor to receive the articles so the portion of article to be electroplated extends downwardly from the conveyor and is received in a receiver which shields the outside of the article whereby the portion to be electroplated is passed through at least one cell containing electroplating liquid as the conveyor moves and the portion of the article to be electroplated contacts the liquid in the cell wherein the processing liquid is agitated at at least sonic frequency enhance capillary action to effect contact of the liquid with the inner surface of the portion of the part exposed to the liquid.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.