Conductor structure for thick film electrical device
US4546283A · kind A · utility
12Cited by
13References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 4, 1984 |
| Grant date | Oct 8, 1985 |
| Priority date | — |
| Expiry date | May 4, 2004 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/0391
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A thick film device conductor arrangement suitable for making connections between a resiliently mounted element such as a surface acoustic delay line and adjacent thick film conductors and then with the device connecting pins. The thick film conductors include a double layer structure of differing noble metals each selected for desirable properties in designated areas of the device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.