Metal-clad laminate adapted for printed circuits
US4547408A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 13, 1984 |
| Grant date | Oct 15, 1985 |
| Priority date | — |
| Expiry date | Apr 13, 2004 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31975
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A metallized, laminated substrate well adapted for the production of printed circuits is comprised of: PA0 (A) an electrically insulating support element which comprises (a) a central core member comprising a major proportion by weight of a cellulosic or mica filler and a minor proportion by weight of a thermosetting resin, and (b) and (b') a pair of skin laminae coextensively secured to each face surface, respectively, of said central core (a), each of said skin laminae comprising a fibrous glass, asbestos or heat-stable synthetic polymer reinforcing filler, and a thermosetting resin impregnant, which thermosetting resin may either be the same as or different from the thermosetting resin comprising said central core member (a); and PA0 (B) an electrically conducting metal foil (c) coextensively adhered to the exposed face surface of one or the other of said skin laminae (b) or (b').
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.