Electroless copper deposition solution
US4548644A · kind A · utility
13Cited by
4References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 23, 1983 |
| Grant date | Oct 22, 1985 |
| Priority date | — |
| Expiry date | Sep 23, 2003 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C18/40
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An electroless copper deposition solution comprising (a) cupric ions, a complexing agent for cupric ions, a reducing agent and a pH adjusting agent, (b) a polyoxyethylene ether and (c) at least one member selected from the group consisting of an inorganic cyanide and .alpha.,.alpha.'-dipyridyl can give a deposited film with high elongation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.