Solderable polymer thick films
US4548879A · kind A · utility
24Cited by
4References
27Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 21, 1984 |
| Grant date | Oct 22, 1985 |
| Priority date | — |
| Expiry date | May 21, 2004 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24917
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
This invention discloses conductive compositions having improved solderability. These compositions contain metal and/or alloys thereof coated with saturated monocarboxylic acid which is dispersed in an organic polymeric matrix. Also disclosed is a method for preparing these conductive compositions. Another embodiment of the invention is a method of coating metal and/or alloys thereof with carboxylic acid.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.