Hot-melt adhesive
US4548985A · kind A · utility
20Cited by
6References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 27, 1983 |
| Grant date | Oct 22, 1985 |
| Priority date | — |
| Expiry date | Jun 27, 2003 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31913
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
Disclosed is a hot-melt adhesive composed of a composition comprising an acid-modified olefin resin formed by graft modification of an ethylenically unsaturated carboxylic acid or its anhydride or a resin composition containing said modified olefin resin and an oxirane ring-containing compound, wherein said composition has a carbonyl group concentration of 1 to 600 millimoles per 100 g of the composition and an oxirane oxygen concentration of 0.01 to 50 millimoles per 100 g of the composition.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.