Shock absorbing transducer module
US4550429A · kind A · utility
17Cited by
21References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 3, 1983 |
| Grant date | Oct 29, 1985 |
| Priority date | — |
| Expiry date | Jun 3, 2003 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04R1/025
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A modular transducer mounting arrangement includes a substantially planar support plate. An aperture having an angular bevel is provided in the support plate such that a loudspeaker may be positioned in the bevel to allow sound to exit from the loudspeaker in a manner which is substantially unobstructed acoustically. An adhesive shock absorbing pad is attached to the rear of the support plate for isolating the loudspeaker microphone and support plate from mechanical shock. This creates a free floating and reliable transducer mounting assembly which provides shock isolation and easy serviceability.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.