Compression molding apparatus having vacuum chamber
US4551085A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 14, 1984 |
| Grant date | Nov 5, 1985 |
| Priority date | — |
| Expiry date | Dec 14, 2004 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S425/06
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
Apparatus is disclosed for compresseion molding a part from a charge having a curable resin therein. Provision is made for defining a vacuum chamber surrounding the mold cavity when the upper and lower dies are brought to a partially closed position. The vacuum chamber includes a vertically movable ring surrounding the upper die which is urged into sealing engagement with a surface surrounding the lower die. The ring has a wiper blade mounted in a position to contact the side wall of the upper die thereby permitting relative vertical movement between the ring and die. The mold cavity is rapidly evacuated and then the upper die is brought into a fully closed position while the resin cures.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.