Curable resin composition
US4551215A · kind A · utility
4Cited by
4References
3Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 30, 1983 |
| Grant date | Nov 5, 1985 |
| Priority date | — |
| Expiry date | Aug 30, 2003 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08G59/1461
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A curable resin composition comprising PA0 (I) an epoxy compound having at least two epoxy groups in the molecule, PA0 (II) a component selected from the group consisting of photopolymerizable compound having carboxyl group in the molecule, and the mixture of the photopolymerizable compound and the other photopolymerizable compound, and PA0 (III) a photosensitizer, which provides a cured material having excellent properties such as adhesion, chemical resistance, water resistance, transparency and the like.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.