Patent · US Expired

Positive resist material

US4551414A · kind A · utility

7Cited by

6References

7Claims

0Family size

Assignee

Max-Planck-Gesellschaft zur Föderung der Wissenschaften e.V. · US

Inventors

Frithjof Asmussen · Berlin, DE
Hideto Sotobayashi · Berlin, DE
Jiang-Tsun Chen · Berlin, DE
Wolfram Schnabel · Idstein, DE

Key dates

Filing date	Feb 3, 1983
Grant date	Nov 5, 1985
Priority date	—
Expiry date	Feb 3, 2003

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10S430/168
WIPO fieldOptics
WIPO sectorInstruments

Abstract

The invention relates to positive resist materials of thermally crosslinkable methacrylic polymers soluble in organic solvents, which are characterized in that the methacrylic polymers are copolymers of 80 to 98 mol-% of fluoroalkylmethacrylate and 20 to 2 mol-% of methacrylic acid chloride or chloroalkylmethacrylate. The resists of the invention are very well suited for the transfer of microstructures, for example in semiconductor technology. They have, in addition to a high sensitivity, a very good mechanical stability and strength of adhesion.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.