Thermoplastic molding of sinterable silicon carbide
US4551496A · kind A · utility
23Cited by
8References
26Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 11, 1984 |
| Grant date | Nov 5, 1985 |
| Priority date | — |
| Expiry date | Apr 11, 2004 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC04B35/63416
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A thermoplastically moldable ceramic composition comprised of from about 40% to about 60% by volume of a sinterable silicon carbide powder and a binder comprised of an organic acid and a copolymer of ethylene and from greater than about 12 weight % to about 33 weight % vinyl acetate, said organic acid having a melting point ranging from about 44.degree. C. to about 88.degree. C. and ranging from greater than about 18% by weight up to about 45% by weight of the binder. The ceramic composition is thermoplastically molded into a body which is baked to remove the binder and then sintered.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.