Leadless chip carrier apparatus providing for a transmission line environment and improved heat dissipation
US4551747A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Oct 5, 1982 |
| Grant date | Nov 5, 1985 |
| Priority date | — |
| Expiry date | Oct 5, 2002 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/3442
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A carrier apparatus (40) for mounting logic components on the surface of a circuit board (41). The carrier apparatus (40) includes a housing structure defining top and bottom surfaces and further defining a cavity (50) in the bottom surface for receipt of a logic component (51). A recessed cover portion (56) is attached to the housing so as to enclose the cavity (50) thereby effectively sealing the logic component (51) in the housing. The carrier apparatus (40) includes means for mounting the housing on a circuit board such that the cover (56) does not make contact with the surface of the circuit board (41). The housing further includes means for electrically interconnecting the logic component (51) to the circuit board (41). In yet another embodiment, a carrier apparatus (100) for mounting logic components on the surface of a circuit board (41) is disclosed which utilize ground and voltage planes together with alternating signal (118) and AC ground (121) traces so as to effectuate coplanar/strip-line and coplanar/microstrip transmission line environments along portions of the signal traces (118). Consequently, this results in signal lines having a controlled impedance environment …
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.