Highly integrated universal tape bonding
US4551912A · kind A · utility
16Cited by
7References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 1, 1985 |
| Grant date | Nov 12, 1985 |
| Priority date | — |
| Expiry date | Apr 1, 2005 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49121
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of forming semiconductor devices wherein a continuous metallic sheet is cut under computer control into a personalized lead pattern. The pattern is then moved to a bonding station. A bonding tool actuated by computer control moves from one terminal end to another to sequentially bond terminals to the semiconductor device. A variety of various patterns and chips can be handled on the same line using common cutting and bonding tools. A second bond can be made from the lead pattern to either a lead frame or a substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.