Plate bending apparatus
US4552002A · kind A · utility
11Cited by
6References
3Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 14, 1985 |
| Grant date | Nov 12, 1985 |
| Priority date | — |
| Expiry date | Feb 14, 2005 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S72/702
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
An apparatus for bending a plate utilizing a bending punch and a die into which the bending punch penetrates to a greater or lesser extent depending on the bending angle .alpha.. The magnitude and variation of the bending force required during deformation of the plate unit are determined and utilized to determine the depth h of punch penetration.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.