Method and apparatus for soldering and desoldering leadless semiconductor modules for printed wiring boards
US4552300A · kind A · utility
42Cited by
14References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 9, 1983 |
| Grant date | Nov 12, 1985 |
| Priority date | — |
| Expiry date | May 9, 2003 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K2101/42
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method and apparatus is disclosed for soldering leadless semiconductor modules having contact pads on the bottom thereof to and desoldering them from leaded terminal pads on a printed wiring board. The device includes a housing having a bore in which is slidably mounted a suction head. The suction head is used to raise and lower the module relative to the leaded terminals. The suction head has a passageway connected to a source of vacuum for both holding the module relative to the head as well as exhausting heated air from a source which is directed against the leaded terminals to melt same.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.