Patent · US Expired

Method of bonding ceramic components together or to metallic components

US4552301A · kind A · utility

8Cited by

4References

4Claims

0Family size

Assignee

U.S. Philips Corporation · US

Inventors

Manfred Liehr · Hamburg, DE
Wolfgang Nolting · Hamburg, DE
Rolf U. D. Kobs · Tornesch, DE
Reiner U. Orlowski · Quickborn, DE

Key dates

Filing date	May 17, 1984
Grant date	Nov 12, 1985
Priority date	—
Expiry date	May 17, 2004

Classification

Technology area (CPC C)Chemistry; Metallurgy
CPC primaryC04B2237/406
WIPO fieldMaterials, metallurgy
WIPO sectorChemistry

Abstract

The invention relates to a method for the force-coupled and vacuum-tight bonding of components of ceramic material together or to metallic components by means of thermocompression while using a soldering material in the form of an AlMgZn alloy provided between the components to be bonded prior to the thermocompression process. The soldering material used consists preferably of an aluminum-zinc-magnesium alloy having 95% by weight of Al, 4% by weight of Zn and 1% by weight of Mg.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.