Bonding method employing film adhesives
US4552604A · kind A · utility
73Cited by
9References
9Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | May 27, 1980 |
| Grant date | Nov 12, 1985 |
| Priority date | — |
| Expiry date | May 27, 2000 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31522
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A process for bonding surfaces together comprises PA0 (i) exposing to actinic radiation a layer of a liquid composition containing an epoxide resin, photopolymerizable compound, and a heat-activated curing agent for epoxide resins until the composition solidifies to form a film adhesive while the epoxide resin remains substantially heat-curable, PA0 (ii) sandwiching the film adhesive between the surfaces to be bonded, and PA0 (iii) then heating the assembly so that the epoxide resin component of the film adhesive is cured. Surfaces which may be so bonded may be metal, glass, ceramic, or wood.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.