Method of making electrically conductive thin epoxy bond
US4552607A · kind A · utility
3Cited by
9References
3Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jun 4, 1984 |
| Grant date | Nov 12, 1985 |
| Priority date | — |
| Expiry date | Jun 4, 2004 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10977
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present invention is a method and structure which produces extremely thin, electrically conductive epoxy bonds between two substrates. Copper microspheres, having an average diameter of about 2 microns are bound in an epoxy layer which bonds two substrates together. The microspheres make electrical contact between the substrates while providing intersphere gaps which are filled with the epoxy which actually bonds the substrates together.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.