Heat-curable epoxy resin mixtures containing imide compounds and condensation products of phenols, amines and aldehydes or ketones
US4552935A · kind A · utility
5Cited by
6References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 6, 1984 |
| Grant date | Nov 12, 1985 |
| Priority date | — |
| Expiry date | Jan 6, 2004 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L63/00
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Heat-curable mixtures containing (a) epoxy compounds having on average more than one 1,2-epoxy group per molecule, (b) monoimides or polyimides of specific unsaturated dicarboxylic acids of the formula I ##STR1## wherein A is an x-valent aromatic or aliphatic radical, R.sup.1 is hydrogen or methyl, and x is 1, 2 or 3, and (c) products of condensing specific phenols, specific amines and aldehydes or ketones in an acid medium. The novel curable mixtures have a long shelf life and give rise to moulded materials which are highly resistant to chemicals and resistant to boiling water.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.