High density planar interconnected integrated circuit package
US4553192A · kind A · utility
131Cited by
16References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 25, 1983 |
| Grant date | Nov 12, 1985 |
| Priority date | — |
| Expiry date | Aug 25, 2003 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An integrated circuit module to printed circuit board interconnection system wherein the board has circuit pads to which spring contacts have one of their ends soldered to the pads. The module has circuit pads on one surface thereof and a pivotal connection is provided for loading the module onto the circuit board whereby the opposite ends of the spring contacts engage the circuit pads on the module with a wiping action and are retained in engagement therewith.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.