Selective plating apparatus
US4553501A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Mar 14, 1984 |
| Grant date | Nov 19, 1985 |
| Priority date | — |
| Expiry date | Mar 14, 2004 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D5/02
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An apparatus for selectively plating on an elongated metal strip, at intervals of a predetermined length in the lengthwise direction, while the strip is being fed in the lengthwise direction. The apparatus includes: strip feeder which discharges the strip from a reel in a direction in which the strip is fed and a sensor for detecting the amount of slack in the strip. A pre-treating station treats the strip, before being plated, while it is continuously fed. A plating station intermittently feeds the strip and selectively plates it, while the strip is stopped during its intermittent movement. An after-treating station treats the strip by again continuously feeding the strip and a strip take-up section winds the strip onto a reel after it has been treated. Tension mechanisms are disposed between the continuous feeding station and the intermittent feeding station to impart a predetermined tensile force to the strip. The continuous and intermittent movements of the strip are synchronized with each other by controlling the speed of the strip in the continuous feeding station.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.