Multilayer hybrid integrated circuit
US4554229A · kind A · utility
50Cited by
8References
9Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Apr 6, 1984 |
| Grant date | Nov 19, 1985 |
| Priority date | — |
| Expiry date | Apr 6, 2004 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S430/121
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A multilayer circuit device comprises a substrate having a plurality of metallized patterns thereon said patterns being separated by a photodefined polymeric dielectric film formed from a polymeric photodefinable triazine base mixture including a photosensitive acrylate moiety. The various circuit patterns are interconnected by means of microvias through the polymeric film or film layers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.