Hot melt butylene/ethylene adhesives
US4554304A · kind A · utility
36Cited by
6References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 31, 1984 |
| Grant date | Nov 19, 1985 |
| Priority date | — |
| Expiry date | May 31, 2004 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S526/935
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
Hot melt adhesives with long open time good bonding to cold metals are made of blends of a maleic anhydride modified copolymer of butene-1 and ethylene, an aliphatic, substantially non-polar resin, a antioxidizing agent and, optionally, microcrystalline wax, a block copolymer and atactic polypropylene.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.