Patent · US Expired

Packaging unit for semiconductor wafers

US4555024A · kind A · utility

46Cited by

4References

7Claims

0Family size

Assignee

Wacker Chemie AG · DE

Inventors

Jurgen Voss · Wiesbaden, DE
Otto Dombkowski · Haag in Oberbayern, DE
Walter Kudlich · Burghausen, DE
Jan Stodulka · Tittmoning, DE

Key dates

Filing date	Nov 5, 1984
Grant date	Nov 26, 1985
Priority date	—
Expiry date	Nov 5, 2004

Classification

Technology area (CPC H)Electricity
CPC primaryH01L21/67386
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A three-component tray-type packaging unit for semiconductor wafers, compatible with automatic equipment, includes a wafer carrier enclosed between a tub-shaped lower portion for receiving the wafer carrier and a matching lid. The wafers are fixed at four contact points-namely, in the wafer carrier by two rows of spring tongues arranged tangentially with respect to the wafer, and in the matching lid by two rows of inwardly projecting retention cones.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.