Forming patterns in metallic or ceramic substrates
US4555285A · kind A · utility
11Cited by
11References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 14, 1983 |
| Grant date | Nov 26, 1985 |
| Priority date | — |
| Expiry date | Dec 14, 2003 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/128
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method for forming a pattern in a metallic and/or ceramic substrate by laminating together the substrate which is in the green stage and a composite of a photosensitive material and a backing wherein the photosensitive material has been developed into the desired pattern, and then subjecting the substrate to elevated temperatures in order to cause sintering of the substrate and removal of the photosensitive material, thereby resulting in embedding of the pattern into the sintered substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.