Patent · US Expired

Molding compositions based on high molecular weight polyether ester amides

US4555550A · kind A · utility

2Cited by
3References
10Claims
0Family size

Assignee

Inventors

Key dates

Filing dateFeb 25, 1985
Grant dateNov 26, 1985
Priority date
Expiry dateFeb 25, 2005

Classification

  • Technology area (CPC C)Chemistry; Metallurgy
  • CPC primaryC08K5/29
  • WIPO fieldMacromolecular chemistry, polymers
  • WIPO sectorChemistry

Abstract

Improved molding compositions based on high-molecular polyether ester amides are obtained by heating at 180.degree.-250.degree. C. a melt containing a mixture of PA0 A. a polyether ester amide having a relative solution viscosity .eta..sub.rel of at least 1.5; and PA0 B. 0.05-1.5 parts by weight, based on 100 parts by weight of the molding composition, of a cyclic, trimerized isophorone diisocyanate or an oligomer thereof having a degree of oligomerization of 2-5 and an isocyanate functionality of 3-7.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.