Molding compositions based on high molecular weight polyether ester amides
US4555550A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Feb 25, 1985 |
| Grant date | Nov 26, 1985 |
| Priority date | — |
| Expiry date | Feb 25, 2005 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08K5/29
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Improved molding compositions based on high-molecular polyether ester amides are obtained by heating at 180.degree.-250.degree. C. a melt containing a mixture of PA0 A. a polyether ester amide having a relative solution viscosity .eta..sub.rel of at least 1.5; and PA0 B. 0.05-1.5 parts by weight, based on 100 parts by weight of the molding composition, of a cyclic, trimerized isophorone diisocyanate or an oligomer thereof having a degree of oligomerization of 2-5 and an isocyanate functionality of 3-7.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.