Electroless copper plating solution
US4557762A · kind A · utility
6Cited by
4References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 30, 1984 |
| Grant date | Dec 10, 1985 |
| Priority date | — |
| Expiry date | Jul 30, 2004 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C18/405
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An electroless copper plating solution comprising cupric ions, a complexing agent, a reducing agent, a pH adjuster, a perfluoropolyether, a cyanide and/or .alpha.,.alpha.'-dipyridyl and/or 1,10-phenanthroline or a derivative thereof is capable of forming a deposited film with high elongation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.