Hot press
US4557792A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 16, 1984 |
| Grant date | Dec 10, 1985 |
| Priority date | — |
| Expiry date | Apr 16, 2004 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S100/918
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A hot press capable of minimizing a displacement of one substrate from another in multilayer printed circuit boards each constituted by a plurality of substrates having wiring pattern groups printed thereon which are pressed together by applying pressure into a multilayer printed circuit board. The end is attained by minimizing a variation in thickness from a central portion of the board to a peripheral portion thereof. The hot press includes plate thickness adjusting devices each interposed between each bolster and each heat insulating member to compress and deform the heat insulating members beforehand. By imparting a deformation beforehand to each heat insulating member, contacting surfaces of the heat insulating members become substantially planer when they are compressed as pressure is applied to the substrates to press them together into a multilayer printed circuit board, thereby minimizing the variation in thickness from one portion to another in the multilayer printed circuit board produced by the hot press.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.