Method of dry copper etching and its implementation

US4557796A · kind A · utility

Assignee

• International Business Machines Corporation · US

Inventors

• Frank Druschke · Stuttgart, DE
• Georg Kraus · Konz, DE
• Ulrich Kuenzel · Tübingen, DE
• Wolf-Dieter Ruh · Sindelfingen, DE
• Rolf Schaefer · Mainz, DE

Key dates

• Filing date: Aug 1, 1984
• Grant date: Dec 10, 1985
• Expiry date: Aug 1, 2004

Classification

• Technology area (CPC H): Electricity
• CPC primary: H05K2203/095
• WIPO field: Audio-visual technology
• WIPO sector: Electrical engineering

Abstract

According to this method, copper is dry etched in a glow discharge containing compounds with at least one methyl or methylene group, particularly at temperatures close to room temperature. The method is applied in particular for making conductors on or in module substrates or circuit cards, solder spots, and the wiring of magnetic thin films.