Solventless, polyimide-modified epoxy composition
US4557860A · kind A · utility
36Cited by
10References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 6, 1984 |
| Grant date | Dec 10, 1985 |
| Priority date | — |
| Expiry date | Jul 6, 2004 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/386
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Adhesive compositions are disclosed which comprise: (a) an epoxy resin; (b) a soluble polyimide resin; and (c) a monoepoxy diluent. Such compositions are curable by using conventional epoxy curing agent(s). If desired, conductive adhesives of this type can be formed by blending the composition with a conductive filler component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.