Method for providing a pattern-wise photoresist layer on a substrate plate and a surface-protected substrate plate therefor
US4557996A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | May 29, 1984 |
| Grant date | Dec 10, 1985 |
| Priority date | — |
| Expiry date | May 29, 2004 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/066
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
The invention provides an improved method for the so-called dry-film process for forming a pattern-wise photoresist layer on the substrate surface in which a substrate is overlaid and laminated with a preformed film of a photosensitive composition called a dry film and photolithographically processed. In the inventive method, different from conventional dry-film processes, the substrate plate is first provided with a protecting layer of a photosensitive composition containing a halation inhibitor and the lamination with a dry film is performed without removing the protecting layer. After pattern-wise exposure to light, development of the photosensitive layer is undertaken by use of a developer solvent capable of dissolving both of the protecting layer and the pattern-forming layer. Despite the intervention of the protecting layer, the resolving power and image reproducibility are excellent.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.