Multiple connection bond pad for an integrated circuit device and method of making same
US4558345A · kind A · utility
22Cited by
6References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 27, 1983 |
| Grant date | Dec 10, 1985 |
| Priority date | — |
| Expiry date | Oct 27, 2003 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/14
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A bond region is provided on an integrated circuit chip wherein the bond region has two or more sets of closely spaced conductors, each of which is electrically connected to a different point of the integrated circuit. During the manufacturing of the device, at the time of assembly of the chip into the package one end of a connector wire may, optionally, be bonded to the bond region thereby effecting a multiple connection of these different points of the integrated circuit. Such a procedure will enable a specific mode of operation of a multi-mode device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.