Highly reliable hermetically sealed package for a semiconductor device
US4558346A · kind A · utility
10Cited by
1References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 23, 1983 |
| Grant date | Dec 10, 1985 |
| Priority date | — |
| Expiry date | Mar 23, 2003 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49144
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device having a hermetically sealed package which includes a package substrate having a gold layer, an integrated-circuit chip attached to the gold layer, a terminal metal chip attached to the gold layer so as to ground the terminal metal chips leads, bonding wires, a cap, and glass layers for sealing the device. The terminal metal chip has a lower coating layer made of a gold-silicon type of alloy for attachment. The bond strength of the terminal metal chip is not decreased although a heat treatment is carried out to seal the glass.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.