Cooling module for integrated circuit chips
US4558395A · kind A · utility
60Cited by
4References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 26, 1984 |
| Grant date | Dec 10, 1985 |
| Priority date | — |
| Expiry date | Apr 26, 2004 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/16225
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A cooling module for integrated circuit chips comprising a plurality of integrated circuit chips mounted on a wiring substrate, cooling members respectively provided for integrated circuit chips, each of the cooling members having therein space for circulating the coolant, and flexible pipes connected to respective cooling members, the coolant being caused to flow into or out of said space of said cooling member through the flexible pipes in order to remove heat from the integrated circuit chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.