Process for the deposition of metals on semiconductor powders
US4559237A · kind A · utility
7Cited by
1References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 30, 1984 |
| Grant date | Dec 17, 1985 |
| Priority date | — |
| Expiry date | Oct 30, 2004 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P10/20
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
Gold, silver or palladium can be deposited by photoredox reaction on semiconductor oxide powders by irradiating a suspension of semiconductor oxide powder in the presence of oxygen, CO.sub.2 or mixtures thereof, of an oxidizable system which protects the semiconductor from photocorrosion, and of a salt or complex of copper, lead, mercury, tin, gold, silver or palladium.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.