Curable epoxy resins
US4559398A · kind A · utility
8Cited by
2References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 31, 1984 |
| Grant date | Dec 17, 1985 |
| Priority date | — |
| Expiry date | Jul 31, 2004 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08K5/3445
- WIPO fieldOrganic fine chemistry
- WIPO sectorChemistry
Abstract
A curable composition consisting of PA0 A. 100 parts by weight of an epoxy resin, PA0 B. from 4 to 100 parts by weight of a conventional curing agent for epoxy resins, and PA0 C. from 0.1 to 5 parts by weight of an N-acylimidazole which possesses an aromatic acyl component which is substituted at the two positions ortho to the carbonyl group can be used to produce moldings, coatings, finishes, adhesives and composite fiber materials.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.