Process for encapsulating articles with optional laser printing
US4560580A · kind A · utility
15Cited by
11References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 19, 1984 |
| Grant date | Dec 24, 1985 |
| Priority date | — |
| Expiry date | Mar 19, 2004 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Articles, such as electrical circuits or elements, are encapsulated by melting polyarylene sulfide in combination with at least one print compound such as monazo-nickel complex, lead chromate-lead molybdate, quinacridone, Ni--Sb--Ti, Co--Zn--SiO.sub.2 or lead chromate, injecting this molten composition around the article to be encapsulated, and cooling and solidifying the molten composition. The articles may latter be laser printed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.