Method for improving the density, strength and bonding of coatings
US4562090A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Nov 30, 1983 |
| Grant date | Dec 31, 1985 |
| Priority date | — |
| Expiry date | Nov 30, 2003 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D5/50
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The method of the present invention improves the density, strength and bonding of coatings which have previously been applied to substrates by prior art methods such as chemical deposition, electrochemical processed, thermal deposition, and mechanical coating. The method of the present invention subjects the coated substrate to a thermal mechanical process in the form of a compressive stress which is applied to the coating at a temperature greater than about 0.5 T.sub.i and less than T.sub.i where T.sub.i is the incipient melting temperature. The compressive stress is preferably applied through a pressure transfer medium and should be greater in magnitude than about 30 ksi. The dwell time under maximum compressive stress can be from about 0.1 second to about 10 seconds depending on the temperature of the coating, the substrate and the magnitude of the compressive stress.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.