Primer for metal films on nonmetallic substrates
US4563400A · kind A · utility
17Cited by
13References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 19, 1985 |
| Grant date | Jan 7, 1986 |
| Priority date | — |
| Expiry date | Feb 19, 2005 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12653
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A method is disclosed for improving the adhesion of sputtered metal films such as silver and copper by means of first depositing a primer layer of a metal such as stainless steel.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.