Package providing high heat dissipation, in particular for microelectronics
US4563541A · kind A · utility
4Cited by
4References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 3, 1984 |
| Grant date | Jan 7, 1986 |
| Priority date | — |
| Expiry date | Jan 3, 2004 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/01079
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A package of the flatpack type for microelectronic circuits comprises a metal base of material having good heat conductivity on which a metal frame is mounted by means of a hard brazing alloy. The frame has the function of supporting connections by means of insulating lead-in bushings of the glass bead type. The coefficient of expansion of the frame and of the base are matched so as to ensure that the base of the package does not exhibit any defect of surface planarity after cooling.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.