Metallization of electrically insulating polymeric film substrates
US4564424A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 16, 1984 |
| Grant date | Jan 14, 1986 |
| Priority date | — |
| Expiry date | Apr 16, 2004 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31504
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Electrically insulating polymeric film substrates are conductively metallized, e.g., to provide base members useful in the fabrication of printed circuits and the like, by (1) shaping into such film substrate an intimate homogeneous admixture of a film-forming polymer matrix having from 10 to 70 percent by total weight of said admixture of finely divided, non-conductive metal oxide particles uniformly distributed therein, (2) disrupting at least one face surface of said shaped film substrate to expose thereon a plurality of said finely divided, non-conductive metal oxide particles, (3) treating said at least one disrupted face surface with a preferably borohydride reducing agent to reduce said exposed metal oxide particles into a layer of electrically conductive free metal, whereby said at least one face surface is rendered electrically conductive, and, advantageously, (4) eletrolytically depositing a reinforcing, electrically conductive metallic overlayer atop said first layer of electrically conductive free metal.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.