Target assembly for sputtering magnetic material
US4564435A · kind A · utility
24Cited by
10References
8Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | May 23, 1985 |
| Grant date | Jan 14, 1986 |
| Priority date | — |
| Expiry date | May 23, 2005 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J37/3497
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An optimized annular sputter target assembly for use in sputtering magnetic material, comprising a thin target piece of magnetic material mounted on a backing structure of nonmagnetic material. Said backing structure provides means for easy mounting and removal of the target assembly and for providing good thermal and electrical contact with the cooling wall of the sputter source. The target piece has a portion extending radially outwardly from said cooling wall thereby providing greater target surface area.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.