Photosensitive resin composition
US4564580A · kind A · utility
Assignees
Inventors
Key dates
| Filing date | Jun 26, 1984 |
| Grant date | Jan 14, 1986 |
| Priority date | — |
| Expiry date | Jun 26, 2004 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S430/107
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Disclosed is a photosensitive resin composition comprising an aqueous dispersion or emulsion comprising components (1), (3) and (4) as indispensable components and optionally the following component (2): PA0 (1) a water-soluble saponified vinyl acetate polymer to which a styrylpyridinium or styrylquinolinium group has been added; PA0 (2) a water-dispersible or hydrophobic polymer; PA0 (3) a photo-polymerizable unsaturated compound having an ethylenically unsaturated group; and PA0 (4) a photo-polymerization initiator. This composition has excellent dispersion stability, sensitivity and resolving power and produces a hardened product having good solvent resistance, water resistance and abrasion resistance.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.