Metallization of electrically insulating polyimide/aromatic polyamide film substrates
US4565606A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Apr 16, 1984 |
| Grant date | Jan 21, 1986 |
| Priority date | — |
| Expiry date | Apr 16, 2004 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31721
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Electrically insulating polyimide/aromatic polyamide film substrates are conductively metallized, e.g., to provide highly thermally stable base members useful in the fabrication of printed circuits and the like, by (1) shaping into such essentially thermosetting film substrate an intimate homogeneous admixture of a film-forming polyimide/aromatic polyamide matrix having from 20 to 60 percent by total weight of said admixture of finely divided, non-conductive metal oxide particles uniformly distributed therein, (2) disrupting at least one face surface of said shaped film substrate to expose thereon a plurality of said finely divided, non-conductive metal oxide particles, (3) treating said at least one disrupted face surface with a preferably borohydride reducing agent to reduce said exposed metal oxide particles into a layer of electrically conductive free metal, whereby said at least one surface is rendered electrically conductive, and, advantageously, (4) electrolytically depositing a reinforcing, electrically conductive metallic overlayer atop said first layer of electrically conductive free metal.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.