System and method for application of internal heating to thermally responsive structures
US4565728A · kind A · utility
13Cited by
6References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 1, 1984 |
| Grant date | Jan 21, 1986 |
| Priority date | — |
| Expiry date | Oct 1, 2004 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/2826
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A thermally responsive substrate includes an electric circuit extending throughout the substrate and providing multiple terminal pads through the substrate for the application of electrical current for heating the thermally responsive substrate. A tool for the application of electrical current to the terminals pads includes a device having multiple spaced apart contact probes for engaging selected terminal pads of the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.